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This is a 5g tube of thermal adhesive paste rated at 1.2 W/m-K, meant to bond heatsinks to chips while conducting heat. It cures faster at higher temperatures and is rated to withstand 200℃. The 1.2 W/m-K rating is modest next to mainstream thermal pastes, which run several times higher, so it suits low-power parts and permanent bonds more than high-wattage CPUs or GPUs. It is a one-part adhesive, so it saves the step of mixing a two-part epoxy.
In stockSold by REZUOFIReturns: Sold by a Walmart Marketplace seller; returns go to the seller under the seller's returns policy.
This is a thermal adhesive glue for bonding heatsinks to electronics. It conducts heat and bonds strongly. It comes in a 5g package.
It resists temperatures up to 200℃. Curing speeds up as the temperature rises. Apply a thin layer, 0.1-0.5 mm thick, and the thinner the better.
Before use, clean the surfaces to be bonded with a cleaner such as alcohol. Do not clean them with detergent before applying.